Characterization of DFPAK and Evaluation of DFPAK in an Inverter Application
Application
EV propulsion inverter
Research
Diamond wafer (photo credit to https://www.df.com/)
This project will characterize DFPAK devices packaged by Diamond Foundry (DF) and build and test the inverter based on such device. Both electrical and thermal tests will be carried out by the UTK team to understand the benefits of using diamonds as thermal interface material, e.g., low thermal impedance thereby smaller footprint, as well as its system-level in electric vehicle (EV) drive inverters.
How WBG Can Help
The diamond substrate will significantly reduce the thermal resistance thereby improving WBG devices' poor I^2*t capability
Personnel Involved
Students
- Xin Xia